| PART |
Description |
Maker |
| V437432S24V |
3.3 VOLT 32M x 72 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM ECC MODULE
|
MOSEL[Mosel Vitelic, Corp]
|
| AT45DB321B-RI AT45DB321B-TI AT45DB321B-RC AT45DB32 |
CABLE ASSEMBLY; N MALE TO N MALE; 50 OHM, RG178B/U COAX 32M X 1 FLASH 2.7V PROM, PBGA44
32-megabit 2.7-volt Only DataFlash 32兆位2.7伏只的DataFlash
32-megabit 2.7-volt Only DataFlash 32M X 1 FLASH 2.7V PROM, PDSO28
|
Atmel Corp.
Atmel, Corp.
|
| V436532S04VATG-10PC |
ER 10C 10#16 PIN RECP
3.3 VOLT 32M x 64 HIGH PERFORMANCE PC100 UNBUFFERED SDRAM MODULE
|
Mosel Vitelic, Corp.
MOSEL[Mosel Vitelic, Corp]
Mosel Vitelic Corp
Mosel Vitelic Corp
|
| V436632R24VXTG-75PCL V436632R24VL V436632R24VXTG-1 |
3.3 VOLT 32M x 64 LOW PROFILE UNBUFFERED SDRAM MODULE
|
Mosel Vitelic, Corp.
MOSEL[Mosel Vitelic, Corp]
Mosel Vitelic Corp
|
| AT49SN6416 |
64M bit and 32M, 1.8-Volt Burst and Page Mode Flash Memory
|
Atmel Corp
|
| R01AN1504EJ0100 |
Using the DTC to Perform Continuous Clock
|
Renesas Electronics Corporation
|
| S70WS512N00BAWA20 S70WS512N00BAWAA3 S70WS512N00BFW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
|
SPANSION[SPANSION]
|
| V54C3256164VALT6 V54C3256804VAT V54C3256404VAT V54 |
256Mbit SDRAM 3.3 VOLT, TSOP II / SOC BGA / WBGA PACKAGE 16M X 16, 32M X 8, 64M X 4 56Mbit SDRAM.3伏，第二的TSOP /系统芯片的BGA / WBGA包装16米x 162 × 84米4
|
Mosel Vitelic, Corp.
|
| 1760 |
WOODHEAD? TESTERS PERFORM BASIC-VERIFICATION AND MULTIFUNCTION WIRE TESTING WITH COMPACT, SIMPLE-TO-USE DEVICES THAT
|
Molex Electronics Ltd.
|
| KMM372F3200BS1 KMM372F3280BS1 |
32M x 72 DRAM DIMM with ECC using 16Mx4, 4K 8K Refresh, 3.3V 32M × 72配置的DRAM内存的ECC的使6Mx4KK的刷新，3.3
|
Samsung Semiconductor Co., Ltd.
|
